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Physics Professor Receives Grant from U.S. Department of Defense

Published: 11/06/2013

Physics professor Michael Bozack received a grant from the U.S. Department of Defense for research addressing the reliability of Sn-Ag-Cu lead-free solder alloys under harsh environmental conditions. The work follows a successful world-wide effort to develop alternative, environmentally friendly materials for electronics packaging. Currently, SAC alloys have replaced conventional lead-bearing solder alloys in most consumer electronics. The grant from the U.S. Department of Defense will provide Bozack and a team of Auburn University scientists with more than $2 million to run a comprehensive program of tests to fully explore solutions to the SAC solder joint reliability problem.
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